Nitrogen trifluoride (NF3) is a kind of colorless, odorless and character stable gas, it is also a kind of strong oxidant. Its melting point is 206.8 ℃, boiling point is 129.0 ℃, insoluble in water. Nitrogen trifluoride in the microelectronics industry is a kind of excellent plasma etching gas, which is cracked into active fluorine ion during the process of plasma etching. For the plasma etching of silicon and silicon nitride, using nitrogen trifluoride has higher etching rate and selectivity than using of carbon tetrafluoride or carbon tetrafluoride and oxygen mixed gas, especially in the process of etching integrated circuit material with the thickness of less than 1.5 μm, nitrogen trifluoride has excellent etching rate and selectivity, what's more, there is no pollution on the surface of etched material, it is also a good cleaning agent.
Nitrogen trifluoride can be used as fluorine source of high energy chemical laser gas and as etching agent for semiconductor materials such as polysilicon, silicon nitride and tungsten silicide. It can also be used as a cleaning agent for chemical vapor deposition chamber and LCD panel. Nitrogen trifluoride is used as a cleaning agent for CVD box, which can reduce pollutant emission by 90% compared with perfluorocarbons, and significantly improve the cleaning speed and cleaning capacity.
Nitrogen trifluoride is filled in a steel seamless cylinder with the volume of 8L, 40L, 43.3L and 47L, respectively. The pressure of cylinder is 9.0-13.0MPa. Packaging specifications can be customized according to customers' requirements.